When you compare the BCN3D Epsilon W50 to the Ultimaker S5 you can see which Printer is better. Let's take a look of the comparison, and see which model of Printer out ontop.
BCN3D Epsilon W50 | Ultimaker S5 | |
---|---|---|
Overview | ||
Extruder Type | Bowden Bondtech dual drive gears | |
Print Technology | Fused Filament Fabrication | |
Performance | ||
Usable Filament Diameter | 2.85 mm | 2.85 mm |
Max Power Consumption | 840 W | 500 W |
Build Area | 420 mm x 300 mm x 400 mm | 330 mm x 240 mm x 300 mm |
Build Plate Attachment | clamp | |
Ambient Operating Temperature | 15°C - 30°C | 15°C - 32°C |
Internal Memory | ||
Max. Nozzle Temperature | 300 ºC | 280 ºC |
Build Volume | 330 mm x 240 mm x 300 mm | |
Number of Extruders | 2 | 2 |
Build Plate Leveling System | Advanced Active Leveling | |
Filament Chamber Closed | Yes | Yes |
Open Filament System | Yes | Yes |
Max Build Plate Temperature | 120 ºC | 140 ºC |
Layer Height | 0.05 - 0.5 mm | |
Usable Nozzle Type | ||
Extruder Construction Type Dual | IDEX - Independent Dual Extruders | Dual-head with electronic lifting system |
Total Mass Overall Dimensions | 539 mm x 690 mm x 900 mm | 495 mm x 585 mm x 780 mm |
Resolution | 20 - 600 µm | |
Build Chamber During Process | Open or Closed | closed |
Dual Build Area | 420 mm x 300 mm x 400 mm | |
Connectivity | ||
Cloud Control | Yes | |
USB Port | Yes | |
Ethernet Port | Yes | Yes |
WLAN | Yes | Yes |
Features | ||
Door Sensor | Yes | |
Build Chamber Heater | Yes, max 60°C | |
Touchscreen | Yes | Yes |
Hepa Filter | Yes | No |
SD Card | Yes | |
Filament Runout Sensor | Yes | Yes |
Powerloss Fail Safe | Yes | |
System | ||
Weight | 37 kg | 20.6 kg |
Dimensions | 539 mm x 690 mm x 900 mm | 495 mm x 585 mm x 780 mm |
Voltage | AC: 84 V, 3,6 A - 240 V, 1,3 A (50-60 Hz) | |
Total Weight | 37 kg | 20.6 kg |